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Wrapping process - Company Ranking(5 companies in total)

Last Updated： Aggregation Period:May 27, 2026〜Jun 23, 2026
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Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
シンコー シンコー
[Grinding/Processing Method Introduction] Lapping Process (Double-Sided Grinding)
[Grinding/Processing Method Introduction] Lapping Process (Double-Sided Grinding)

Other

 【Work Size and Specifications】 ■ Work Size: Up to φ100mm (□100mm), t0.05mm and above ■ Machining Accuracy: ±0.001mm and above ■ Surface Roug... [Processed Materials] ■ Ceramics (Silicon Nitride [SiN]), Alumina, Zirconia, Aluminum Nitride (AlN), Barium Titanate, Strontium Titan...
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  1. シンコー シンコー
    Featured Products
    [Grinding/Processing Method Introduction] Lapping Process (Double-Sided Grinding)[Grinding/Processing Method Introduction] Lapping Process (Double-Sided Grinding)
    overview
    【Work Size and Specifications】 ■ Work Size: Up to φ100mm (□100mm), t0.05mm and above ■ Machining Accuracy: ±0.001mm and above ■ Surface Roug...
    Application/Performance example
    [Processed Materials] ■ Ceramics (Silicon Nitride [SiN]), Alumina, Zirconia, Aluminum Nitride (AlN), Barium Titanate, Strontium Titan...
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